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Capabilities
Design Tools
RF Design Tools
- HFSS
- ADS
- Momentum
- Sonnet em
- FEMLAB
- Q3D Extractor
- Wizard
- ePhysics
- In-house software tools.
MEMS Design and Layout Tools
- CoventorWare
- MEMSPro
- Cadence
- Ledit
- Ansys
- IDEA
Optical Design Tools
- R-soft
- In-house software tools
Fabrication
- PECVD deposition of nitride, silicon oxide
- RIE etching of nitride, silicon oxide
- E-beam evaporation and sputtering of metals
- Spin coating of low-K and high K materials
- Wet etching and photolithography
- Laser micromachining (Green and UV)
- Critical Point CO2 Dryer
- Electroplating: gold and silver
Packaging
- Wire/ribbon bonding
- Flip chip bonding
- Substrate to carrier attachment
- Surface micromachining for wafer level
packaging
Testing
- VNA frequency domain testing up to 40 GHz, with time domain capability
- On-wafer probe testing (room temperature)
- On-wafer probe testing in vacuum (10-6 torr) over temperatures
down to 10 K with laser trimming capability
- A temperature controlled chamber for testing devices down to 77 K
- Optical breadboarding and bench testing
- A multi-channel MEMS driver station
- Multifunction generators, power suppliers, high
frequency bias tees, etc
