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RF Lab Facilities
JFP Microtechnic Flip-Chip Bonder
- Allows the user to simultaneously view the underside of the
die and the topside of the substrate to which the die will be
attached
- Two colour CCD cameras allow the die image and the substrate
image to be superimposed on a monitor; this allows for fine alignment
of die and substrate prior to attachment
- Variable directional lighting of both die and substrate allow
features to be illuminated during alignment
- Uses a combination of work surface heat, tool heat, force, and ultrasonic
energy to attach the die to the substrate
- Uses an attached vacuum system for the pick and place functionality
- Bond force, bond delay, and ultrasonic energy applied during
bond are all user adjustable
- Work surface and tool temperature
up to 400C
