skip navigation
Clean Room Facilities
Logitech Chemical Delayering and Planarization System
- 8" diameter wafer to single IC capability
- Automated process control for repeatable results
- Various process parameters such as:
- Platen rotational speed
- Carrier rotational speed, down force, and back pressure
- Carrier sweep speed and linear travel
- Platen temperature
- Slurry flow rate
- In-situ conditioning of the polishing pad
- Mulitiple memory locations for process storage
Logitech Website
