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Clean Room Facilities
Trion Orion Plasma-Enhance Chemical Vapor Deposition (PECVD) System
- Wafer transfer using a robotic arm within a load-lock
- Load lock uses a mechanical vacuum pump
- Reactor chamber uses a dry pump
- System is liquid cooled using an external chiller
- 8” diameter wafer chuck
- Wafer chuck temperature: 400C
- RF Power: 300 Watts (max)
- Fully automated processing from pump-down to deposition
- Two gas manifolds that are mixed at reactor shower-head
- Gases available for processes:
