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Clean Room Facilities
Trion Phantom Reactive Ion Etcher (RIE)
- Reactor chamber lid automatically opens and closes
- Turbo pump backed by mechanical pump
- System is liquid cooled using an external chiller
- User manually loads wafers
- 8” diameter wafer chuck
- RF Power: 600 Watts (max)
- ICP Power: 1000 Watts (max)
- Fully automated processing from pump-down to deposition
- Single gas manifold
- Gases available for processes:
- CF4, SF6, O2, CHF3, He/O2 Mix
